发明名称 ELECTRONIC EQUIPMENT CASE AND THERMAL CONDUCTION PATH MEMBER USED THEREIN
摘要 PROBLEM TO BE SOLVED: To provide an electronic equipment case and a thermal conduction path member used to it, in which heat released from a first case of large heating quantity is transferred to a second case of small heat released quantity without impeding the opening/closing of the second case and dissipated outside through a natural convection. SOLUTION: A heat dissipating part 21 which is formed integrally as a part of a second case 20 that is opened or closed by a hinge 37 to a first case 24 to dissipate heat outside, a thermal conduction path 22 connected to the one end of the heat dissipating part 21 and arranged astride the second case and the first case 24, and a heat receiving part 23 which is provided inside the first case 24, connected to the thermal conduction path 22, and receives heat generated inside the first case 24 are formed integrally into a seamless electronic equipment case. The thermal conduction path member is constituted to function as a joint connected to a member which heats, conducts or dissipates heat from a plurality of ends of graphite sheets and equipped with a rolled part composed of graphite sheets which are rolled up with an insulating sheet inserted to the one side or both sides of a graphite sheet.
申请公布号 JP2000232284(A) 申请公布日期 2000.08.22
申请号 JP19990128567 申请日期 1999.05.10
申请人 FUJITSU LTD 发明人 KIMURA KOICHI;MIYAHARA SHOICHI;NISHII KOTA;KAWARADA MOTONOBU;NATORI KATSUHIDE
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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