| 摘要 |
PROBLEM TO BE SOLVED: To remedy the fluidity and weighing accuracy of a granular semiconductor sealing material composed of a thermosetting resin composition, by preventing the clogging of a hopper, etc., with the material due to deposition, cross-linking phenomena, etc., in a sealing process without degrading the various characteristics of the material as a sealing material by specifying the degree of compaction of the material. SOLUTION: A granular semiconductor sealing material is composed of a thermosetting resin composition and formed in powder or grains. In addition, the degree of compaction expressed by the formula is set at <=11%. In the formula, the initial bulk density is the measured value obtained when a sample arbitrarily extracted from the whole material is measured in conformity to JIS R1628. In addition, the tap packing rate is the measured result obtained when the sample is measured in conformity to JIS R1628. Therefore, the fluidity and weighing accuracy of the material are improved and the occurrence of such a failure as the void, etc., is suppressed, because the clogging of a hopper, etc., with the material due to adhesion, cross-linking phenomena, etc., is remedied.
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