| 发明名称 |
Method of manufacturing a semiconductor chip |
| 摘要 |
In a method of manufacturing a semiconductor chip, a wire is traveled in one way to cut a wafer into a plurality of chips while a wire train where wires are arranged by pitches of scribe lines is brought into contact with the scribe lines of the wafer linearly, and an abrasive solution is supplied to a contact portion thereof.
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| 申请公布号 |
US6107163(A) |
申请公布日期 |
2000.08.22 |
| 申请号 |
US19980081987 |
申请日期 |
1998.05.20 |
| 申请人 |
SEIKO INSTRUMENTS INC. |
发明人 |
KOJIMA, YOSHIKAZU;KAMIYA, MASAAKI |
| 分类号 |
H01L21/301;B23D57/00;B28D5/04;H01L21/304;(IPC1-7):H01L21/46 |
主分类号 |
H01L21/301 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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