| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for measuring the continuity of a board for a semiconductor package in which a contact resistance is stabilized and whose measuring accuracy is high. SOLUTION: In this method for measuring the continuity of a board 10 for a semiconductor package provided with a plurality of board circuits 40, each of which comprises a connecting pad group 20 and a connecting pad group 30 which are exposed respectively on the surface side and on the rear side, an elastic conductive member 51 is brought into pressure contact with respective pads 21 in the connecting pad group 20 out of the connecting pad groups 20, 30, measuring probes 52 are brought individually into contact with respective pads 31 in the connecting pad group 30 on the other side, and the continuity state of the board circuit 40 is measured across the conductive member 51 and the measuring probes 52.
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