| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder bump transfer discrimination device which is capable of accurately discriminating whether solder bumps are transferred well or not even if a printed wiring board is low in alignment accuracy. SOLUTION: A printed wiring board is equipped with an insulating board, an insulating resin film (solder resist) which covers the surface of the insulating board, and solder bumps which are transferred to the openings of the solder resist film. A transfer discrimination device discriminating whether the solder bumps are transferred well or not based on electric conduction. The transfer discrimination device is equipped with a contact pin 1, and the contact pin 1 is composed of a main body 11 and a columnar pin tip 12 smaller in diameter than the main body 11. The pin tip 12 is 0.1 mm or less in diameter S and possessed of a contacting edge face 123 whose diameter F is 0.08 mm or less.
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