| 摘要 |
PROBLEM TO BE SOLVED: To form a metal electrode having tight constitution and to reduce a resistant component by including a step of joining a metallic foil on a substrate and patterning it in the metal electrode shape. SOLUTION: In this manufacturing method, a metallic foil 42 is joined on a transparent electrode 40 with a ceramic paste and the metallic foil 42 and an antioxidant film 41 are patterned to form a pattern 41A of a bus electrode 42A and the antioxidant film 41. Then, a photosensitive resin pattern 44 is deposited on the transparent electrode 40 as well as the bus electrode 42A and a transparent electrode substance (ITO) layer 46 is deposited throughout the surface. The transparent electrode substance layer 46 is deposited on the surface of the pattern 41A and the photosensitive resin pattern 44 and the exposed transparent electrode 40 by vacuum deposition, sputtering or ion-plating. By removing the photosensitive resin pattern 44, a transparent electrode 46A is formed. In this case, the metallic foil separately prepared is used without using a sputtering process so that a thick metal electrode is easily formed and a resistance component can be reduced. |
