发明名称 |
Filtering apparatus with stirrer in a CMP apparatus |
摘要 |
A chemical-mechanical polishing (CMP) apparatus includes a filtering apparatus for filtering slurry. The filtering apparatus includes an input aperture located at the top of the filter housing and connected to a slurry supplying machine. An output aperture located at the side of the filter housing is connected to a polishing pad. The filtering apparatus also includes a filter attached to the top of the filter housing and a stirring objected located below the filter. A stirrer is located below the filter housing for driving the stirring object without a mechanical contact. The stirring object is preferably bar-shaped and enclosed with PTFE.
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申请公布号 |
US6106714(A) |
申请公布日期 |
2000.08.22 |
申请号 |
US19980111036 |
申请日期 |
1998.07.07 |
申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
CHIU, HAO-KUANG;PENG, PENG-YIH |
分类号 |
B01D29/11;(IPC1-7):B01D35/00 |
主分类号 |
B01D29/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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