| 摘要 |
PROBLEM TO BE SOLVED: To confirm misalignment accurately without delaying an index by non-swelling chuck even if a substrate is slightly left extended, by realizing plane chuck by means of a part made of porous material which corresponds to a semiconductor pellet mounting part on the top face of a substrate stage. SOLUTION: In the chuck mechanism of a substrate stage, a part for chucking a corresponding part to a semiconductor pellet mounting part is at least made of porous material such as a sintered metal filter, for plane chuck. A part for chucking a support frame and a part for chucking a tape substrate are made to be chucked independently by vacuum. Further, a nozzle 10 is provided to jet a gas to the surface of the tape substrate 2 at a bonding position P as a center. Thus, a period of time between the completion of bonding of semiconductor pellet and confirmation of misalignment before bonding of the following semiconductor pellet can be shortened, which is useful for high-speed operation of a die bonder. |
