发明名称 |
Metal foil connection and solder grain fraction for metal foil connection |
摘要 |
A metal foil connection of first and second metal foils having a thickness of less than 0.05 mm includes a connecting point in which the metal foils are brazed to one another. The connecting point forms a wedge which is filled with brazing medium. A mass of the brazing medium, and a mass of sections of the metal foils which the brazing medium contacts in the wedge, have a given ratio. A honeycomb body, a brazing medium particle fraction and a method for manufacturing metal foil connections with a thickness of less than 50 micrometers, are also provided. |
申请公布号 |
AU2107500(A) |
申请公布日期 |
2000.08.18 |
申请号 |
AU20000021075 |
申请日期 |
2000.01.11 |
申请人 |
EMITEC GESELLSCHAFT FUR EMISSIONSTECHNOLOGIE MBH |
发明人 |
LUDWIG WIERES;FERDI KURTH;HELGE SCHLOTMANN |
分类号 |
B23K1/00;B23K3/06;B23K35/14;B23K101/02 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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