发明名称 Metal foil connection and solder grain fraction for metal foil connection
摘要 A metal foil connection of first and second metal foils having a thickness of less than 0.05 mm includes a connecting point in which the metal foils are brazed to one another. The connecting point forms a wedge which is filled with brazing medium. A mass of the brazing medium, and a mass of sections of the metal foils which the brazing medium contacts in the wedge, have a given ratio. A honeycomb body, a brazing medium particle fraction and a method for manufacturing metal foil connections with a thickness of less than 50 micrometers, are also provided.
申请公布号 AU2107500(A) 申请公布日期 2000.08.18
申请号 AU20000021075 申请日期 2000.01.11
申请人 EMITEC GESELLSCHAFT FUR EMISSIONSTECHNOLOGIE MBH 发明人 LUDWIG WIERES;FERDI KURTH;HELGE SCHLOTMANN
分类号 B23K1/00;B23K3/06;B23K35/14;B23K101/02 主分类号 B23K1/00
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