DEVICE FOR BONDING STRUCTURE OF LASER DIODE

摘要

PURPOSE: A device for bonding structure of laser diode is provided to reduce the strength imposed when adhering the cathode of a laser diode to an electrode pad. CONSTITUTION: A device for bonding structure of laser diode includes the following components. A laser diode(32) attached to a heat conductor(31). An insulator is formed right on top of the heat conductor(31). An electrode pad(34) is formed by connecting to the cathode of the laser diode(32). The part of the electrode pad(34) that is linked to the cathode of the laser diode(32) looks like the teeth of a comb. The device for bonding structure of laser diode makes a form of the teeth of a comb when the cathode of the laser diode(32) and the electrode pad is connected. The electrode pad enables the laser diode(32) to save energy so as to prevent any scratches from occurring. Eventually, the life span of the laser diode(32) will increase, and at the same time enables users to get hundreds of £W| laser output because setting the laser diode bonding structure is much easier.