发明名称 HEAT DISSIPATION DEVICE FOR HIGH POWER PACKAGE
摘要 PURPOSE: A heat dissipation device is to dissipate a high temperature heat generated in a package by providing a hydriding metal and a dehydriding metal or a hydrogen containing tank without separate electricity applying unit. CONSTITUTION: A heat dissipation device comprises: a container(2) attached on a top surface of a package(1) by an adhesive(3); a first hydriding metal(4) which is arranged under inside of the container and hydrated; a second hydriding metal(6) which is arranged upper side of the container and is dehydrated; and an adiabatic agent(5) arranged between the hydriding metal and the dehydrated metal. The adiabatic agent passes hydrogen but does not pass most of heat. As temperature of the package rises, dehydriding reaction begins in the first hydriding metal to absorb heat generated in the package. Thus, the package is cooled and the generated hydrogen is collected in a hydrogen collecting tank.
申请公布号 KR20000051188(A) 申请公布日期 2000.08.16
申请号 KR19990001485 申请日期 1999.01.19
申请人 HYUNDAI MICRO ELECTRONICS CO., LTD. 发明人 PARK, IK SEONG
分类号 H01L23/34;(IPC1-7):H01L23/34 主分类号 H01L23/34
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