| 摘要 |
PURPOSE: A semiconductor device having an improved signature circuit array is provided to reduce the time required for cutting fuses included in the signature circuit array by shortening the traveling time of a laser for the cutting, and thereby to improve productivity. CONSTITUTION: While a semiconductor device has a plurality of input/output pins(10) connected with internal circuitry thereof, a plurality of signature circuits(25) are concentrated together in signature circuit arrays(20) and electrically connected with the respective input/output pins(10). Each signature circuit(25) includes a plurality of NMOS transistors, a first signature fuse, and a resistor, all of which are connected in series between one of the input/output pins(10) and one of power pins(30,40). In addition, the signature circuit(25) further includes a second signature fuse connected in parallel between the first signature fuse and the resistor. Since the signature circuits(25) are concentrated in the signature circuit arrays(20), the traveling time of the laser used for cutting the first and second fuses is considerably shortened.
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