| 摘要 |
PURPOSE: A load lock chamber is provided to preventing an eddy flow generated by pressure difference between inner and outer sides of a chamber. CONSTITUTION: A dry etching apparatus includes a load lock chamber(140) loading a cassette(120) through a door(130) to carry a wafer(122), a transfer part(106), and a process chamber(102). An open part(132) connected to a transfer part is placed on circumference of a load lock chamber. A pressure of a load lock chamber as well as one of a process chamber should be in vacuum while a wafer is transferred to a process chamber by a transfer part. After completing an etching process in a process chamber, a wafer is transferred to a load lock chamber by a transfer part. A first gauge(124) placed on inside of a load lock chamber detects an inner pressure, and a second pressure gauge(126) placed on outside of a load lock chamber detects an atmospheric pressure. They are provided to a controller(128) calculating a pressure difference. A controller opens a door only when a calculated result is within predetermined range so an eddy flow is prevented.
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