Laser machining apparatus

摘要

In a laser machining apparatus for performing a laser repair process on a semiconductor wafer, fuses are selectively melted based on the result of judging. A method for aligning a laser machining apparatus for applying a laser beam for laser machining, includes the steps of: detecting a position of a first specific point for alignment provided on an object-to-be-machined; computing a position of a second specific point for alignment other than the first specific point, based on a detected position of the first specific point; detecting a position of the second specific point; and comparing the computed position of the second specific point with the detected position of the second specific point. When the difference between both positions is above a preset threshold value, the laser machining is interrupted.