| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit, capable of directly writing individual management information and test information of chips, that is obtained in a manufacturing step for all the chips, and reading the information in the event of a breakdown after assembling steps, so that basic data for analyzing breakdown can be obtained. SOLUTION: In an exposure step for a semiconductor integrated circuit, individual management information such as a lot number, a wafer number, coordinates in the wafer is written to the surface or the back of each chip by pattern formation using an aligner. Or a laser is disposed on a die sort tester, and test information such as a test item and a test result of the disort tester as well as the individual management information is written to the surface or the back of each chip by using a laser beam. Or these information is written from an input terminal of a programmable ROM(PROM) disposed together with a mask read only memory(ROM) in a large semiconductor integrated circuit, such as a microprocessor. This arrangement enables dramatic improvement of the tracing ability on the individual chips to analyze breakdown. |
