| 摘要 |
PROBLEM TO BE SOLVED: To prevent an extension dimension of a bonding wire for connecting electrically a space between a circuir chip and a sensor chip from getting long excessively, in the case where the sensor chip is arranged on the ciurcuit chip. SOLUTION: A sensor chip 1 having one-dimensional dynamic quantity detecting axis X parallel to a chip main surface is mounted on a chip mounting area 27 set on a circuit chip 19. The mounting area 27 is set as an area to mount selectively the sensor chip 1 in a condition where the sensor chip 1 is directed to either of the first direction in which the detecting axis X of the sensor chip 1 forms 45 deg. with respect to a reference edge part SE of the circuit chip 19 and the second direction (each direction forming 0 deg. or 90 deg.) different from the first direction. Plural electrode pads 28 connected via electrode pads 3b, 6c, 7c, 13a in a sensor chip 1 side and bonding wires 24 are provided in positions adjacent to the chip mounting area 27 in the circuit chip 19.
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