发明名称 LIQUID EPOXY RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain an epoxy resin composition improved in rapid curability and storage stability and giving a cured product improved in heat resistance, water resistance, and electrical properties by selecting a liquid epoxy resin composition comprising an epoxy resin, a curing agent, a cure accelerator, and, optionally, other adjuvants, wherein the cure accelerator is a specified imidazoline compound or an adduct thereof with an isocyanate. SOLUTION: The cure accelerator used is at least one compound selected from the group consisting of an adduct of an imidazoline compound represented by formula I with an isocyanate, a bisimidazoline compound represented by formula II, and an adduct thereof with an isocyanate. In formula I, R1 is hydrogen, a 1-17C alkyl, or a (substituted) phenyl; and R2 and R3 are each hydrogen, a 1-5C alkyl, phenyl, or benzyl. In formula II, R4 to R7 are each hydrogen, a 1-5C alkyl, phenyl, or benzyl; and n is an integer of 2-10. When the composition needs to have storage stability, it is desirable that the respective compounds are used in the form of organic acid salts.
申请公布号 JP2000226441(A) 申请公布日期 2000.08.15
申请号 JP19990029962 申请日期 1999.02.08
申请人 TOSOH CORP 发明人 YOSHIMURA HIROYUKI;HORIE HARUYUKI
分类号 C08G59/68;(IPC1-7):C08G59/68 主分类号 C08G59/68
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