| 摘要 |
PROBLEM TO BE SOLVED: To realize easy manufacturing and prevent wetting outgrowth of adhesive. SOLUTION: The manufacturing method of a wiring board 1 has a process for sticking an adhesive sheet to a reinforcing board 12; a sheet cutting/grooving process for cutting an adhesive sheet stuck to the reinforcing board 12 to form an adhesive sheet piece of a specified shape, and at the same time forming recessed grooves 15, 16 which approximately coincide with a cutting line of the adhesive sheet in the reinforcing board 12; and an adhesion process for putting an adhesive sheet piece stuck to the reinforcing board 12 on a wiring board body 2, heating it and adhering the reinforcing board 12 and the wiring board body 2 through the adhesive layer 25. Therefore, an adhesive sheet piece can be readily handled and an adhesive sheet piece can be stuck to a specified position of the reinforcing board 12 surely. Furthermore, even if adhesive effuses from an adhesive sheet piece, the recessed groove 15, etc., can prevent its wetting outgrowth. Therefore, it is possible to prevent adhesive from flowing out to a side surface 1C of the wiring board 1 and an inside of a region near a connection pad 3 whereon an integrated circuit chip is mounted.
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