GRINDING WHEEL STARTING POINT POSITIONING MECHANISM IN WAFER GRINDING DEVICE

摘要

PROBLEM TO BE SOLVED: To exactly determine a starting point position of a grinding wheel for a short time by providing a sensor for sensing contact with a grinding wheel and a holding tool for holding a contact contacting a chuck mechanism on an upper side and a lower side, respectively, at a tip of an arm fixed in the horizontal direction. SOLUTION: By supplying air from an air supply port of a grinding wheel starting point positioning mechanism 16 and rotating an oscillation table 162e by an angle determined by a right angle adjusting bolt, a shaft 163 is rotated. A sensor 166a and a contact 166b held by a holding tool 167 in a lower side direction at a tip of an arm 164 fixed in the horizontal direction by an arm holder 165 on an upper side of a shaft are moved on a chuck mechanism 9b on which wafer of an index table 9 is not mounted yet. A grinding wheel 11 supported on a spindle shaft 10a is lowered, the grinding wheel 11 is brought into contact with the sensor 166a and a position where the contact 166b on the lower side of the sensor 166a is brought into contact with a surface of the chuck mechanism 9b is stored as a grinding wheel starting point in a CPU.