| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element package with a large current capacity and low cost. SOLUTION: A high power semiconductor element package 30 has a flat conductive terminal 31 with a large capacity for mounting a semiconductor die. A thin conductive tab 34 is arranged on the upper plane of the terminal 31 with the tab insulated from the flat terminal 31 having a large capacity. The upper surface electrode of the semiconductor die is connected with the tab 34. Both ends adjacent to the tab, the terminal 31, the semiconductor die and connector conductor thereof are sealed in an insulating housing 33. Free ends of the tab 34 may have printed circuit connecting fingers 37a, 37b and 37c. Two notches 40, 41 are formed on both sides of the tab 34 with slight distances from the surface of the housing 33 in which the thin tab is inserted to extend. Thereby, the stress to the housing 33 in which the tab 34 is inserted to extend is relaxed. |
