| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing head, a CMP(chemical mechanical polishing) polishing device, and a polishing method, where not only ensures the peripheral part of a wafer of polishing uniformity, and an edge cut (EE: edge exclusion) can be made as small as possible. SOLUTION: A work 4 (polished member) held on a polishing head 1 is pressed down against on the surface of a polishing body 3, the work 4 and the polishing body 3 are moved relative with respect to each other interposing abrasive material between them, with which the work 4 is polished by the polishing, head 1. The polishing head 1 is equipped with an elastic film 13 with which the work 4 is held, a ring 23 to which the periphery of the elastic film 13 is fastened, a flexible holding member 8 to which the ring 23 is fixed, a hermetic space 9 formed inside the polishing head 1 making the elastic film 13 serve as a part of a boundary, and a hermetic member 14 provided to the ring 12 so as to form a hermetic space 9. |
