| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board which is free of the disorder of a conductor pattern, etc., by making a resin film absorb moisture or liquid in wet treatment processes such as a surface roughening process by a wet treatment such as wet blasting and liquid honing, a patterning process for photoresist, and a wet treatment process such as a process for plating a metal layer. SOLUTION: For the manufacture, the resin film 1 which has a 5 to 10×10-6/ deg.C coefficient of thermal expansion, <=1 g.20μ/m2.day steam permeability, <=0.1% water absorptivity, and a >=260 deg.C melting point has its surface roughened by a wet blast treatment or liquid honing treatment, and a conductor layer 3 is formed on the roughened surface by a direct plating method; and a gold plating layer 3 is formed on the surface of the conductor layer 2 and a gold plating layer 6 is formed on the conductor layer 2 which is exposed by forming a via hole 5 in the resin film 1.</p> |
