发明名称 SURFACE PACKAGING CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a surface packaging ceramic electronic component, which can easily correspond to a change in the shape and dimension of its external terminals and is superior in economical efficiency. SOLUTION: External terminals formed by performing a bending work on a metal wire material are used as external terminals 5, which are respectively bonded to the end surfaces of a ceramic electronic component element 4 in such a way as to make continuity with internal electrodes exposed to the end surface of the element 4. The terminals 5, formed by performing the bending work on the metal wire material, are respectively bonded to external electrodes 3 formed on the end surfaces of the element 4 with solder 6. As the metal wire material, a general-purpose lead wire, which is used for an electrical equipment, an electronic equipment or the like, is used.
申请公布号 JP2000223358(A) 申请公布日期 2000.08.11
申请号 JP19990027142 申请日期 1999.02.04
申请人 MURATA MFG CO LTD 发明人 OKURA TAKESHI;TANAKA YUKIO;YOSHIDA KAZUHIRO;KUBOTA KAZUYUKI
分类号 H01G4/228;H01G4/30;(IPC1-7):H01G4/30 主分类号 H01G4/228
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