发明名称 WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board in which the isolation of a signal interconnection conductor is ensured satisfactorily by a through conductor, in which a stable grounding network is formed of a grounding conductor layer and the through conductor, and in which a high-speed signal exceeding, e.g. 10 GHz can be propagated with good efficiency and precisely. SOLUTION: In this wiring board on an insulating base body 1 which is formed by laminating a plurality of insulating layers 1a, 1b, a signal interconnection conductor 3 which is used to propagate a high-frequency signal is arranged and installed, and a grounding conductor layer 4a which is faced with the signal interconnection conductor 3 via the insulating layer 1b is arranged and installed. At least one row each of many through conductors 5 connected to the grounding conductor layer 4a are arranged and installed on both sides of it along the signal interconnection conductor 3. In addition, the through conductors 5 are formed in such a way that their length along the signal interconnection conductor 3 in their cross section is made longer than the length in a direction at right angles. As a result, it is possible to effectively prevent electromagnetic waves from being leaked to the outside from the signal interconnection conductor 3.
申请公布号 JP2000223798(A) 申请公布日期 2000.08.11
申请号 JP19990022102 申请日期 1999.01.29
申请人 KYOCERA CORP 发明人 WADA HISAYOSHI;YOSHIDA KATSUYUKI;MIYAO TAKAYUKI
分类号 H05K1/11;H05K1/02;(IPC1-7):H05K1/02 主分类号 H05K1/11
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