| 摘要 |
PROBLEM TO BE SOLVED: To secure electrical and mechanical connection between a bump electrode and a pad electrode, even substances where electrically insulating fine particles such as silica, alumina, or the like dispersed in large quantity into a resinous adhesive are used for connecting a semiconductor pellet with a wiring board. SOLUTION: In this semiconductor device, a semiconductor pellet 1 where a bump electrode 3 is made and a wiring board 4 where a flat pad electrode 8 is made, corresponding to the bump electrode 3 of the semiconductor pellet 1 at least, on an insulating substrate 5, are faced to each other via a resinous adhesive 9 where fillers 12 for reduction of thermal expansion coefficient are dispersed, and several electrodes are superposed on top of one another and are pressurized to electrically connect each electrode and also to bond the facing opposite faces of the semiconductor pellet 1 and the wiring board 4. In this case, the bump electrode 3 is composed of a metal softer than the fillers wiring the adhesive, and the peripheral section adjacent to the pressure contact end face is bulged by crushing, while pressure-welding this bump electrode 3 to the pad electrode 8 and recessing the surface of the pad electrode 3. |
