LEAD FRAME, RESIN PACKAGE, THEIR MANUFACTURE AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To avoid the resin flash onto inner lead connections and semiconductor element mounts or suppress the resin flash easily removably, if the resin flash is formed thereto. SOLUTION: This lead frame comprises first outgoing leads 11a, composed of a tape-like plate a part on which forms semiconductor element mounts 13, second outgoing leads 11b composed of a tape-like plate a part on which forms inner lead connections 14a-14d, and a support frame 11c which connects the first and second outgoing leads 11a, 11b together into a single body. Recesses are formed in at least, the inner lead connections 14a-14d.