| 摘要 |
PROBLEM TO BE SOLVED: To increase the packaging density and the reliability of a semiconductor device having a BGA(Ball Grid Array) structure. SOLUTION: A semiconductor device comprises a semiconductor chip 23, a wiring board 22 whereon the semiconductor chip 23 is mounted and which has a wiring 25 electrically connected to a resin film 24 and to the semiconductor chip 23, and a solder bump 30 which are joined to the wiring 25 and serves for an external connection terminal. The wiring 25 is formed on a mounting face 24b of the resin film 24 and the semiconductor chip 23 is mounted face up on the wiring board 22. As a means for electrically connecting the semiconductor chip 23 and the wiring 25, a wire 26 is used. In a part of the resin film 24 where the wiring 25 is formed, a through hole section 27 is formed. The wire 26 electrically connects the semiconductor chip 23 and the wiring 25 through the hole section 27. |
