LEAD FRAME FOR SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To firmly install a fin for mounting a semiconductor element or a circuit board on the body of a lead frame for a semiconductor device. SOLUTION: The body of a strip frame 1 of a lead frame for a semiconductor device and a fin 2 arranged in an opening 3 of the main body 1 so as to face a plurality of external terminals 4 to 11 protruding from the main body 1 into the opening 3. The fin 2 is fixed on a supporting lead 12 protruding from an edge part 3a in the width direction of the opening into the opening 3. An extension 13 formed by protruding at least one of the external terminals 4 to 11 into the opening 3 is fixed on the fin 2 to reinforce the supporting lead 12 for supporting the fin 2.