发明名称 THROUGH HOLE FOR PRINTED BOARD AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To evade generation of malfuction or the like of an LSI on a multilayer printed board, and cope with change of wiring direction of each printed board. SOLUTION: In this through hole 10 wherein a penetrating small hole 11 is bored in a multilayer printed board, two spiral type protruding stripe parts 15, 16 are formed on the inner wall surface of the small hole 11 at a specified interval. The stripe parts 15, 16 are formed from one aperture part of the small hole 11 to the other aperture part. Conducting films 12, 13 formed on the inner wall surface of the small hole 11 are divided into at least one region and the other region, and the conducting films in the divided regions are set in the mutually nonconductive state by the spiral type protruding stripe parts 15, 16.
申请公布号 JP2000223841(A) 申请公布日期 2000.08.11
申请号 JP19990018634 申请日期 1999.01.27
申请人 NEC CORP 发明人 SHINODA MASAHIRO
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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