| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a machining tool and method of a piezoelectric element, silicone, etc., thinner than the thickness of a manufacturing limit. SOLUTION: Around several tensμm of electronic materials like a crystal plate 13, silicon or gallium arsenide, etc., are removed by performing RIE (reactive ion etching), etc., from either side or both sides of them after grinding, after that, ruggedness of severalμm to be generated by the removal is ground again by a griding means like a both side grinding machine, etc. Otherwise, piezoelectric materials like, for example, extremely thin and highly accurate crystal plate diagonally 2 inch and 5μm to around 30μm thick or the electronic materials like silicon, a gallium arsenide, etc., are manufactured by chemical wet etching from both sides or either side.</p> |
