发明名称 めっき装置
摘要 PROBLEM TO BE SOLVED: To provide a plating apparatus and a plating processing method capable of converting a posture of a substrate holder into a vertical state from a horizontal state, or into a horizontal state from a vertical state, without using a large scale rotation mechanism, and a posture conversion method for substrate holder for plating apparatus.SOLUTION: The plating apparatus comprises: a table 120 for horizontally mounting a substrate holder holding a substrate detachably, thereon; a plating processing part 130; and a substrate holder transport part 140 having a holding part for holding the substrate holder and transporting the substrate holder between the table 120 and plating processing part 130. The table 120 has a horizontal movement mechanism which supports one end part of the substrate holder and can move in the horizontal direction. The substrate holder transport part 140 comprises a lift mechanism for lifting up and down the holding part in a state that the other end of the substrate holder is supported by the horizontal movement mechanism, for converting a state of the substrate holder into a horizontal state from a vertical state, or into a vertical state from a horizontal state, followed by horizontal movement of the horizontal movement mechanism.
申请公布号 JP6001134(B2) 申请公布日期 2016.10.05
申请号 JP20150100985 申请日期 2015.05.18
申请人 株式会社荏原製作所 发明人 南 吉夫
分类号 C25D17/06;C25D7/12 主分类号 C25D17/06
代理机构 代理人
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