发明名称 |
Process for production of copper or copper base alloys |
摘要 |
There is provided a process for the production of copper or a copper base alloy that can provide a surface having improved characteristics suitable for the production of a connector or a charging-socket of an electric automobile because of having a decreased coefficient of friction on the surface and improved resistance to abrasion, said process comprising coating copper or a copper base alloy with Sn, followed by heat treating the resulting Sn-plated copper or copper base alloy in an atmosphere whose oxygen content is no more than 5%, thereby forming on the outermost surface thereof an oxide film and beneath it a layer of an intermetallic compound mainly comprising Cu-Sn. |
申请公布号 |
EP1026287(A1) |
申请公布日期 |
2000.08.09 |
申请号 |
EP20000102066 |
申请日期 |
2000.02.02 |
申请人 |
DOWA MINING CO., LTD.;YAZAKI CORPORATION |
发明人 |
SUGAWARA, AKIRA;HANA, YOSHITAKE;ENDO, TAKAYOSHI |
分类号 |
C22F1/00;C22C9/00;C22F1/02;C22F1/08;C23C26/00;C25D5/50;H01R13/03 |
主分类号 |
C22F1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|