Contact bumps, for chip embedding in a thin film structure, are produced by plating bumps in depressions in a chip-size recess filling, forming free-standing leads over the bumps and removing the filling

摘要

Contact bump production, by plating bumps (6) in depressions (5) in a chip-size recess filling (3), forming free-standing leads (4) over the bumps and removing the filling, is new. Production of contact bumps, for chip embedding in thin film structures, comprises (a) forming a chip-size recess (2) in a substrate (1); (b) closing the recess with a filling (3) and forming contact bump-size depressions (5) in the filling; (c) plating to form contact bumps (6) and then carrying out a plating/structuring step to cover and connect the contact bumps with free-standing leads (4); and (d) removing the filling to leave free-standing leads, provided with underside contact bumps, as continuations of the structure side (7) of the thin film structure in the region of the chip-size recess (2). Preferred Features: The filling (3) consists of indium.