发明名称 |
Electrical slip ring having a higher circuit density |
摘要 |
<p>Disclosed is a method of manufacturing a slip ring printed circuit board which includes forming a plurality of concentric spaced electrical contacts on one side of a non-conductive base and forming interconnecting electrical paths on an opposite side of the non-conductive base. The method of manufacturing a slip ring printed circuit board also includes electrically connecting the electrical contacts and the interconnecting electrical paths, depositing copper on the electrical contacts to form electrical rings and etching a groove into each of the electrical rings. <IMAGE></p> |
申请公布号 |
EP1026794(A2) |
申请公布日期 |
2000.08.09 |
申请号 |
EP20000102581 |
申请日期 |
2000.02.07 |
申请人 |
LITTON SYSTEMS, INC. |
发明人 |
WITHERSPOON, BARRY KENT;VAUGHT, LARRY DEAN |
分类号 |
H01R39/08;H01R39/10;H01R43/10;H05K1/11;H05K3/10;H05K3/40;(IPC1-7):H01R43/10 |
主分类号 |
H01R39/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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