| 摘要 |
PROBLEM TO BE SOLVED: To provide a CMP polisher with a small foot print in which the exhaustion of the surface of a polishing pad is progressed uniformly in the pad surface by a simple control, even if the diameter of the polishing pad is not enlarged, in the CMP polisher. SOLUTION: In a polisher for polishing the member to be polished by providing a polishing pad part 2 for fixing and moving a polishing pad 5 and a wafer part 1 for holding and moving a wafer 4 and relatively moving the polishing pad 5 and wafer 4 under the state interposing a polishing agent 6 between the polishing pad 5 and wafer 4, vibration mechanisms 11, 8 for giving a liner vibration respectively to the polishing pad 5 and wafer 4 for fixing or holding respectively are provided in the polishing pad part 2 and wafer part 1 and the linear vibration direction 40, 30 of respective vibration mechanism are orthogonally crossed with each other. |
