发明名称 |
Method of controlling the spread of an adhesive on a circuitized organic substrate |
摘要 |
In accordance with the present invention, a method of treating the surface of an organic substrate, particularly a circuitized surface of an organic substrate, which method reduces the spread of adhesive resin that is subsequently deposited on the surface, is provided. This method comprises the steps of applying a treatment solution comprising a fatty acid compound, an alkalizing agent, and a solvent comprising water and from about 5% to about 90% by volume of an organic solvent selected from the group consisting of an alcohol, a glycol ether, and combinations thereof to the surface; and then removing substantially all of the solvent from the solution to provide a thin film on the surface of said substrate. The film comprises the fatty acids that were present in the treatment solution. In a preferred embodiment the treatment solution further comprises a chelating agent. The present invention also relates to a treatment solution for reducing adhesive resin bleed on the surface of a circuitized organic substrate. The present invention also relates to a circuitized organic substrate that is resistant to resin bleed. Such substrate has a film comprising a fatty acid compound disposed on the circuitized surface thereto.
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申请公布号 |
US6099959(A) |
申请公布日期 |
2000.08.08 |
申请号 |
US19980108598 |
申请日期 |
1998.07.01 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
KONRAD, JOHN JOSEPH;PAPATHOMAS, KONSTANTINOS I.;WELSH, JOHN A. |
分类号 |
H01L23/498;H05K3/28;H05K3/30;(IPC1-7):B32B27/04;B32B33/00;C09D5/16;C08L91/00 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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