| 摘要 |
PURPOSE:To solve the problem of heat resisting and moisture resisting insulation so as to obtain a highly reliable small-sized high-density circuit board by using a hardening polyphenylene ether resin composition as the interline insulating material of the circuit board. CONSTITUTION:This high-density circuit board is constituted of conductors 2 formed on both ends of an insulating substrate 1, with the space between the conductors 2 being filled with an interline insulating material 3. Any substrate can be used as the insulating substrate whether it is made of glass-epoxy, polyimide, alumina, insulation-processed metal, etc. In addition, it is preferable to use a hardening polyphenylene ether resin for the substrate 1. It is specially recommended to use copper for the conductors from the viewpoints of the conductivity and economy. While a hardening polyphenylene ether resin can be used for the material 3, the resin is usually used for both interline insulating and overcoat materials. A hardening polyphenylene ether resin composition composed of a hardening polyphenylene ether resin containing an unsaturated group, triallyl isocyanurate and/or triallyl cyanurate, and flame retardant is used as the hardening polyphenylene ether resin. |
