发明名称 |
Method for producing semiconductor device |
摘要 |
Three independent methods for producing a semiconductor device which acts as a monolithic capacitor including a first embodiment having a step for removing SiO2 particles deposited in space remained under a conductive polycrystalline Si layer having a rugged surface, for the purpose to eliminate possibilities in which dust is produced in the process, a second embodiment having a step for producing an SiO2 layer on a conductive polycrystalline Si layer having a rugged surface employing a CVD process which employs thermal decomposition of TEOS in an excess volume of O3 in which no SiO2 particles are produced in space remained under a conductive polycrystalline Si layer having a rugged surface and a third embodiment in which a step for producing a conductive polycrystalline Si layer under a conductive polycrystalline Si layer having a rugged surface is eliminated, for the purpose to eliminate possibilities in which dust is produced in the process.
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申请公布号 |
US6100139(A) |
申请公布日期 |
2000.08.08 |
申请号 |
US19970982122 |
申请日期 |
1997.12.02 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
OGIHARA, HIDETOSHI |
分类号 |
H01L21/02;H01L21/8242;(IPC1-7):H01L21/824 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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