发明名称 Method for producing semiconductor device
摘要 Three independent methods for producing a semiconductor device which acts as a monolithic capacitor including a first embodiment having a step for removing SiO2 particles deposited in space remained under a conductive polycrystalline Si layer having a rugged surface, for the purpose to eliminate possibilities in which dust is produced in the process, a second embodiment having a step for producing an SiO2 layer on a conductive polycrystalline Si layer having a rugged surface employing a CVD process which employs thermal decomposition of TEOS in an excess volume of O3 in which no SiO2 particles are produced in space remained under a conductive polycrystalline Si layer having a rugged surface and a third embodiment in which a step for producing a conductive polycrystalline Si layer under a conductive polycrystalline Si layer having a rugged surface is eliminated, for the purpose to eliminate possibilities in which dust is produced in the process.
申请公布号 US6100139(A) 申请公布日期 2000.08.08
申请号 US19970982122 申请日期 1997.12.02
申请人 OKI ELECTRIC INDUSTRY CO., LTD. 发明人 OGIHARA, HIDETOSHI
分类号 H01L21/02;H01L21/8242;(IPC1-7):H01L21/824 主分类号 H01L21/02
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