| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable an electronic circuit conductor structure formed on a product to be formed at a low cost and easily handled meeting requirements such as a reduction in its size by a method wherein an adhesive material layer is provided on the surface which undergoes processing steps, and a transfer device is provided on the adhesive material layer so as to be connected to the surface. SOLUTION: When the rear of a product 1 where a large number of electronic circuits are formed on its front surface is subjected to a process where it is thinned, a double-sided adhesive foil 3 is laminated on the front 2 of the product 1. A transfer device 4 is provided on the double-sided adhesive foil 3. In this state, the rear of the product 1 is processed to be thin. Thereafter, a double-sided adhesive foil 5 is deposited on the rear of the product 1. In this state, the product 1 is connected to the transfer devices 4 and 5 on its front and rear respectively. Then, the front 2 of the product 1 is to be processed, the transfer device 4 is removed from the front 2, and then the double-sided adhesive foil 3 is removed.</p> |
