| 摘要 |
PROBLEM TO BE SOLVED: To prevent an electronic part from breaking or causing poor connection by preventing warping or bending of a substrate due to resin mold when a magnetic sensitized element or electronic part is attached to resin mold the substrate. SOLUTION: A magnetic sensitized element 1, a permanent magnet 2 which applies a magnetic field to the magnetic sensitized element, and a substrate 4 where a circuit for processing the output signal of the magnetic sensitized element is mounted, are housed in a resin case 10 while supported with a holder 3, with an opening of the case 10 sealed with a sealing resin. Here, the substrate 4 is provided with a resin passage hole 4a to prevent warping or bending of the substrate 4 at resin sealing.
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