MANUFACTURE OF MULTILAYER PRINTED-WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method for a multilayer printed-wiring board whose manufacturing efficiency can be increased. SOLUTION: On the surface of longer metal foils 1, resin varnishes 2 are arranged in a plurality of places along the longitudinal direction of the metal foils 1. The resin varnishes 2 which are arranged on the metal foils 1 are set to a semihardened state. After that, a pair of metal foils 1 are arranged in such a way that the resin varnishes 2 in the semihardened state are faced. A core board 3 is fed continuously between the faced resin varnishes 2, and a combined material 4 is formed. the combined material 4 is heated and pressurized. It is not required to cut the metal foils 1 to prescribed size so as to correspond to the size of the core board 3. It is not required to align the small cut metal foils 1 so as to be overlapped. The metal foils 1 and the core board 3 can be overlapped easily and continuously.