| 摘要 |
PROBLEM TO BE SOLVED: To provide anisotropic conductive adhesive which can ensure insulativity between adjoing circuits in anisotropic conductive adhesion such as adhesion between a IC chip and a circuit board. SOLUTION: This anisotropic conductive adhesive includes (A) epoxy resin, (B) curing agent and (C) conductive particle as essential component. The conductive particle is that insulative inorganic corpuscle such as titanium oxide is adhered on a surface of conductive nucleus particle such as nickel particle. Preferably, mean particle size of the inorganic corpuscle is not more than 5% of that of the conductive nucleus particle, and more than 50% of surface area of the conductive nucleus particle is adhered by the inorganic corpuscle.
|
