| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for cutting a board with a high positional accuracy in order to observe the section of a specific element. SOLUTION: After determining on a board 1 an analytic region 17 including a semiconductor element 2, a line 3 passing through the analytic region 17 is presumed. Then, by projecting a laser beam 10 on the portions present on the line 3, damaged portions 9 are formed on the board 1. Thereafter, by applying forces 6 to some portions present on the board 1, the board 1 is cracked through the damaged portions 9 to expose the section of the board 1 to the external.</p> |
