发明名称 THERMAL STRESS REDUCING PAD, THERMOELECTRIC TRANSDUCING SYSTEM USING THE SAME AND PELTIER COOLING SYSTEM
摘要 PROBLEM TO BE SOLVED: To eliminate the necessity of adjusting a junction or pressing force and guarantee a good conduction of heat and reduce thermal stress by filling a porous matrix with fibers made of such material as to have a high thermal conductivity. SOLUTION: A thermal stress reducing pad 1 can be made just by filling a matrix 2 with fibers 3 oriented in the thickness direction of the pad, that is, the direction in which heat needs to be transmitted, and then hardening the matrix 2. In other words, the thermal stress reducing pad 1 can be manufactured not only easily but also at low cost. Moreover, this pad 1 needs not to be joined either to a thermoelectric transducing unit 4, a heating duct 7, or a cooling duct 8 and therefore the entire power generation system can be assembled easily and replacement of the thermoelectric unit 4 can be facilitated. And, the pad 1 can be provided with a good thermal conductivity characteristic since the porous matrix is filled with the fibers made of such material as to have a high thermal conductivity.
申请公布号 JP2000216444(A) 申请公布日期 2000.08.04
申请号 JP19990011709 申请日期 1999.01.20
申请人 CENTRAL RES INST OF ELECTRIC POWER IND 发明人 KANBE MITSURU;KAWASAKI AKIRA
分类号 H01L35/06;F25B21/02;H01L35/28;H01L35/30;H01L35/34;(IPC1-7):H01L35/28 主分类号 H01L35/06
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