ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To prevent surface temperature rise of the housing of an electronic apparatus effectively while ensuring reduction in size and thickness sufficient for portability of the apparatus. SOLUTION: An electronic part 21 on a printed wiring board 20 mounted on the housing 10 of apparatus is coupled thermally with the heat receiving part 221 of a heat dissipation member 22. Under that assembling state, inside of the housing 10 is partitioned in the planar direction of the printed wiring board 20 by means of the heat dissipation member 22 and the printed wiring board 20. When air is supplied to the heat dissipating part 222 of the heat dissipation member 22 in order to cool the heat dissipating part 222, an air flow is generated in the space between the plate surface of the printed wiring board 20 and the inner wall of the housing 10 partitioned by the heat dissipation member 22 and the printed wiring board 20.