MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT AND MANUFACTURE OF SOLDER INTERCONNECTION THEREIN

摘要

PROBLEM TO BE SOLVED: To assemble a semiconductor package by a method wherein an epoxy layer is formed on a first surface and a first bonding site pattern, openings are provided to the epoxy layer, solder paste is deposited, the solder paste is made to reflow, and the epoxy layer is solidified. SOLUTION: A first bonding site pattern 22 is formed on the first surface of an IC chip 21, the first surface and the first bonding site pattern are coated with an epoxy layer 23, and openings 31 are provided to the epoxy layer 23 to expose the first bonding site pattern 22. Solder paste 35 is deposited in the openings 31, and then the second surface of an interconnection board 37 is brought into contact with the epoxy layer 23, the second bonding site pattern 38 is aligned with the openings 31 of the first surface of the IC chip 21, then the first an second surface are heated to make the solder paste 35 to reflow, and the epoxy layer 23 is solidified.