| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can test together with a replica circuit and a chip main body even when a voltage generating circuit is not mounted on the same chip, and can make real speed measurement of a chip in a wafer state. SOLUTION: In the semiconductor device which has a replica circuit 12 of a critical path and in which a voltage generating circuit is not mounted on a chip, there are provided a buffer 15 and an output pad T12 so as to take out an output of the replica circuit 12 to the outside, and further there is provided an output pad T11 for fetching out an output of a phase and detection circuit 13 integrated within the same chip IC. Thus, when a chip simplex is tested for evaluation, it is possible to observe operating characteristics such as operation frequencies, etc., of the replica circuit 12 from externally and to judge whether or not a critical path delay of a chip main body circuit 11 can be reproduced by operations of the replica circuit 12 constituted at the time of manufacturing the chip IC by comparing the observation results with the operating characteristics of the chip main body.
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