| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in adhesion to the surface of a semiconductor element or the surface of a lead frame by mixing an epoxy resin with a phenolic resin, an organic phosphine compound, and acetamide. SOLUTION: The epoxy resin used is the one represented by formula I (wherein (r) is a 1-6C alkyl or a halogen; (n) and (m) are each 0-4; and R' is H or a 1-4C alkyl). Among the epoxy resins of formula I, an epoxy resin of formula II and a mixture comprising an epoxy resin of formula II and an epoxy resin of formula III in a molar ratio of epoxy resin of formula II/epoxy resin of formula III of 7-3-3/7 are desirable. The mixing ratio of the epoxy resin to the phenolic resin is desirably such that 0.8-1.2 equivalents of the hydroxyl groups of the phenolic resin are present per equivalent of the epoxy groups of the epoxy resin. The mixing ratio of organic phosphine compound/acetamide is desirably 10/1 to 3/1 by weight, and the total of both is desirably 0.02-1 wt.% based on the entire composition.
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