| 摘要 |
PROBLEM TO BE SOLVED: To smooth a film surface by applying the oscillation to an object in a process to generate a vapor deposition film on the surface of the object to reduce the size of clusters and to improve the fine surface roughness of the film surface. SOLUTION: An object 2 in which a vapor deposition film is formed on an anode 5 is provided in a container of a sputtering device. An object oscillating part 9 is provided in the container, the object oscillating part 9 comprises a lamination type piezoelectric element 9a which is provided on the anode 5, one end of which is fixed to the container side and the other end of which is joined with and fixed to the object 2 with an adhesive, an oscillator 9b which supplies the AC voltage to the piezoelectric element 9a in the container, and an oscillograph 9c arranged outside the container to check the output frequency and the output wave number of this oscillator 9b. The object 2 placed on the anode 5 side is swinged in the horizontal direction by driving the piezoelectric element 9a by the AC voltage to be expanded/contracted in the longitudinal direction in the process to generate a vapor deposition film on a surface of the object 2.
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