发明名称 RESIN MOLD APPARATUS AND MOLD USED THEREIN
摘要 PROBLEM TO BE SOLVED: To enable the certain molding of a resin by preventing the generation of a defective product by eliminating the sagging or wrinkles generated in a release film when the release film is sucked to the surface of a mold to flatly support the release film on the surface of the mold under suction. SOLUTION: In a resin molding apparatus, a release film 20 is transferred to the surface of at least one mold among upper and lower molds and sucked to the surface of the mold through the suction holes 30 provided to the mold and a resin is molded using the release film 20 to produce a molded product 12. In this case, a rough surface 40 capable of forming suction flow passages between the release film 20 and the surface of the mold when the release film 20 is sucked to the surface of the mold is formed to the surface to which the release film 20 is sucked of at least one mold among the upper and lower molds.
申请公布号 JP2000210987(A) 申请公布日期 2000.08.02
申请号 JP19990016722 申请日期 1999.01.26
申请人 APIC YAMADA CORP 发明人 MIYAJIMA FUMIO
分类号 H01L21/56;B29C33/18;B29C45/02;B29C45/14;B29C45/26;B29K105/20;(IPC1-7):B29C45/26 主分类号 H01L21/56
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